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High thermal conductivity gel BH-T1060
BH-T 1060 general environmentally friendly non-curing high thermal conductivity material is a flexible silicone thermal gap filler material. It has high thermal conductivity, low interface thermal resistance, and excellent high and low temperature resistance, weather resistance, radiation resistance and superiority The dielectric properties of it are the ideal material for applications with large gap tolerance. It is filled between the electronic components that need to be cooled and the radiator/housing, etc., to bring them into close contact, reduce thermal resistance, and quickly and effectively reduce the temperature of the electronic components, thereby prolonging the service life of the electronic components and improving their reliability.
點膠速率, 30毫升針筒, 90psi
Thermal resistance ~ thickness relationship
Packaging information and usage
1060 is available in 30CC/55CC/180CC/300CC dispensing cartridges and barrels of more than 5 kg. Customized packaging can also be provided upon request. Glue can be applied by hand-held or fully automatic dispenser equipment, select the appropriate packaging, dispensing needle and dispensing pressure, and distribute the required amount of thermal gel to the chip or heat sink. The gel can be easily wiped off when repairing.